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GD300MLT60B3ST

Molding Type Module,3-level in one-package
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Description Drawing

Features

. Low VCE(sat) trench IGBT technology

. 6μs short circuit capability

. VCE(sat) with positive temperature coefficient

. Maximum junction temperature 175℃

. Low inductance case

. Fast & soft reverse recovery anti-parallel FWD

. Isolated copper baseplate using DBC technology

Typical Applications

. Solar power

. UPS

. 3-level-application

IGBT T1 T4 TC=25 unless otherwise noted

Symbol

Description

GD300MLT60B3ST

Unit

VCES

Collector-Emitter Voltage  @ Tj=25

650

V

VGES

Gate-Emitter Voltage  @ Tj=25

±20

V

IC

Collector Current  @ TC=25

@ TC=70

400

300

A

ICM

Pulsed Collector Current  tp=1ms

600

A

Ptot

Total Power Dissipation  @ Tj=175

857

W


Diode D1 D4 TC=25 unless otherwise noted

Symbol

Description

GD300MLT60B3ST

Unit

VRRM

Repetitive Peak Reverse Voltage  @ Tj=25

650

V

IF

DC Forward Current

200

A

IFRM

Repetitive Peak Forward Current  tp=1ms

400

A


IGBT T2 T3 TC=25 unless otherwise noted

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