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Features
l 4500V Planar Gate & Field Stop Structure
l High Robustness
l High Reliability
l Positive Temperature Coefficient
l High Short Circuit Capability
Applications
l HVDC flexible system
l Off-shore wind power generation
l DC Breaker
l Large-scale Industrial Drive
Maximum Rated Values
|
参数 Parameter |
符号 Symbol |
条件 Conditions |
数值 Value |
单位 Unit |
|
集电极‐发射极电压 Collector‐Emitter Voltage |
VCES |
VGE=0V,Tvj=25°C |
4500 |
V |
|
集电极电流 DC Collector Current |
IC |
TC=100°C,Tvj=125°C |
3000 |
A |
|
集电极峰值电流 Peak Collector Current |
ICM |
tp=1ms |
6000 |
A |
|
栅极‐发射极电压 Gate‐Emitter Voltage |
VGES |
|
±20 |
V |
|
总耗散功耗 Total Power Dissipation |
Ptot |
TC=25°C,Tvj=125°C |
31200 |
W |
|
额定正向工作电流 DC Forward Current |
IF |
|
3000 |
A |
|
正向峰值电流 Peak Forward Current |
IFRM |
tp=1ms |
6000 |
A |
|
浪涌电流 Surge Current |
IFSM |
VR=0V,Tvj=125°C, tp=10ms,half‐sinewave |
21000 |
A |
|
IGBT短路耐量 IGBT Short Circuit SOA |
tpsc |
VCC=3400V,VCEM CHIP≤4500V |
10 |
μs |
|
最高结温 Maximum Junction Temperature |
Tvj(max) |
|
125 |
℃ |
|
工作结温 Junction Operating Temperature |
Tvj(op) |
|
‐40~125 |
℃ |
|
环境温度 Case temperature |
TC |
|
‐40~125 |
℃ |
|
存储温度范围 Storage Temperature |
Tstg |
|
‐40~70 |
℃ |
|
安装压力Mounting force |
FM |
|
90~130 |
kN |
Diode Characteristic Values
|
参数 Parameter |
符号 Symbol |
条件 Conditions |
数值 Value |
单位 Unit |
|||
|
Min. |
Typ. |
Max. |
|||||
|
正向电压*4 Forward Voltage |
VF |
IF=3000A |
Tvj=25℃ |
|
2.60 |
|
V |
|
Tvj=125℃ |
|
2.85 |
|
V |
|||
|
反向恢复电流 Reverse Recovery Current |
Irr |
IF=3000A, VR=2800V, diF/dt=‐2500A/μs, VGE=15V, RGon=1.5Ω, LS=140nH, Inductive load |
Tvj=25℃ |
|
1690 |
|
A |
|
Tvj=125℃ |
|
2750 |
|
A |
|||
|
反向恢复电荷 Reverse Recovery Charge |
Qrr |
Tvj=25℃ |
|
3000 |
|
uC |
|
|
Tvj=125℃ |
|
3950 |
|
uC |
|||
|
反向恢复时间 Reverse Recovery Time |
trr |
Tvj=25℃ |
|
1.80 |
|
us |
|
|
Tvj=125℃ |
|
2.20 |
|
us |
|||
|
反向恢复损耗 Reverse Recovery Energy Loss |
Erec |
Tvj=25℃ |
|
4000 |
|
mJ |
|
|
Tvj=125℃ |
|
6300 |
|
mJ |
|||
Package Properties
|
参数 Parameter |
符号 Symbol |
条件 Condition |
Min |
Typ. |
Max |
单位 Unit |
|
|
尺寸 Dimensions |
L x W x H |
Typical |
device clamped |
237.3 x 235.1 x 28.7 |
mm |
||
|
device unclamped |
237.3 x 235.1 x 31.5 |
mm |
|||||
|
表面爬电距离 Surface creepage distance |
da |
according to IEC 60664‐1 and EN 50124‐1 |
23 |
|
|
mm |
|
|
空气电气间隙 Clearance distance in air |
ds |
according to IEC 60664‐1 and EN 50124‐1 |
40 |
|
|
mm |
|
|
模块重量 Module Weight |
G |
|
|
4180 |
|
g |
|
